Follow Slashdot blog updates by subscribing to our blog RSS feed

 



Forgot your password?
typodupeerror
Get HideMyAss! VPN, PC Mag's Top 10 VPNs of 2016 for 55% off for a Limited Time ×
The Internet

Submission + - DARPA wants electronics with radically novel liquid cooling technology (networkworld.com)

coondoggie writes: "With increased electronic minituriztion and the density of the chips running such devices heat is a mortal enemy for the power and scalability of such systems. DARPA today announced a program called Intrachip/Interchip Enhanced Cooling (ICECool) that it hopes will go the heart of such heat problems by building chips with a drastically different way of cooling that uses what the agency calls a microfluid channel inside the chip or component that will more effectively dissipate heat than current cooling technologies."
This discussion was created for logged-in users only, but now has been archived. No new comments can be posted.

DARPA wants electronics with radically novel liquid cooling technology

Comments Filter:

If it is a Miracle, any sort of evidence will answer, but if it is a Fact, proof is necessary. -- Samuel Clemens

Working...